Liquid Cooling Couplers/Connectors/CDM/Manifold

Custom CDM and manifold solutions for liquid cooling applications in high-performance servers, AI systems, and data center infrastructure.

> No leakage during connection and disconnection
> High flow rate, low pressure drop
> Compliant with OCP standards
> Interchangeable with OCP standard products
> Data Center Liquid Cooling
> High-Performance Computing (HPC)
> Al Workloads
> Edge Computing
> Telecom Infrastructure

> Drip-free dry-break design
> Customizable!
> Compatible with major brand and OCP-compliant systems
> Tool-free installation